China's chipmakers put a lot of effort into developing ALD (atomic layer deposition) to overcome the need to buy EUV from ASML. At present, the West reckons that Huawei/SMIC made their Kirin 9000S chip using a modified version of Deep UV from ASML. DUV goes down to 14nm. EUV goes down to 4/5nm. ALD will leapfrog EUV, capable of 1nm.
Huawei wants to grow bigger than the combination of Apple and Qualcomm, it employs 200,000+ staff, half of them work in R&D. If you want to bet on NASDAG, how would you bet?